SiC Electronics

Processing

Aegis Technology uses various process techniques for SiC works including the following:

  • Ceramic-to-metal, carbon-to-ceramic, and carbon-to metal brazing and sealing
  • High-temperature interconnections
  • High-temperature soldering
  • Metallization on AlN and Si3N4
  • Wire bonding

Aegis Technology equipment and facilities include the following:

  • Air Furnace
  • Attritor systems
  • Computer systems with FEA and AutoCAD software
  • Degassing system
  • Glovebox system
  • Hot isostatic press
  • Isotemp Oven
  • Power electronics testing laboratory
  • Screen printer
  • Thermal, mechanical, and electrical characterization equipment
  • Vacuum and controlled-atmosphere furnace
  • Wire bonder

photos_for_processing_and_prototyping1
a) Hot isostatic press machine
b) Cryomilling attritor
c)  Wire bonder
d)  Screen printer